Decapping
Security● Common
Removing the protective packaging from an integrated circuit to expose the silicon die for analysis or attack. Enables visual inspection, probing, laser fault injection, and focused ion beam (FIB) modification. First step in many advanced hardware attacks.
Technical Notes
Methods: chemical (fuming nitric acid), mechanical (grinding/polishing), thermal. Exposes die for: microscopy, probing pads, fault injection access. Secure elements use: active mesh shields, light sensors, anti-tamper coatings. Detectable but not always preventable.
Metadata
Visibility: Public
Created:1/3/2026by System